EB1620YA10-26.000M TR 数据手册
EB1620 Series
REGULATORY COMPLIANCE
2011/65 +
2015/863
191 SVHC
ITEM DESCRIPTION
Automotive Grade Quartz Crystal Resonator 1.6mm x 2.0mm x 0.55mm 4 Pad Ceramic Surface Mount (SMD)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
16MHz to 54MHz
Frequency Tolerance/Stability
Aging at 25°C
±50ppm at 25°C, ±100ppm over -40°C to +85°C
±30ppm at 25°C, ±50ppm over -40°C to +85°C
±15ppm at 25°C, ±30ppm over -40°C to +85°C
±15ppm at 25°C, ±20ppm over -40°C to +85°C
±10ppm at 25°C, ±20ppm over -40°C to +85°C
±50ppm at 25°C, ±100ppm over -40°C to +105°C
±30ppm at 25°C, ±50ppm over -40°C to +105°C
±50ppm at 25°C, ±100ppm over -40°C to +125°C
±30ppm at 25°C, ±50ppm over -40°C to +125°C
±3ppm/year Maximum
Load Capacitance
Series Resonant, 8pF Parallel Resonant to 32pF Parallel Resonant
Shunt Capacitance
3pF Maximum
Equivalent Series Resistance
200 Ohms Maximum over Nominal Frequency of 16MHz to 19.999999MHz
120 Ohms Maximum over Nominal Frequency of 20MHz to 24.999999MHz
100 Ohms Maximum over Nominal Frequency of 25MHz to 39.999999MHz
60 Ohms Maximum over Nominal Frequency of 40MHz to 54MHz
AT-Cut Fundamental
Mode of Operation
Drive Level
Spurious Response
Storage Temperature Range
Insulation Resistance
100µWatts Maximum
Measured from Fo to Fo +5000ppm
-3dB Minimum
-50°C to +150°C
Measured at 100Vdc
500 Megaohms Minimum
Revised A: 05/18/2018
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EB1620 Series
PART NUMBERING GUIDE
Revised A: 05/18/2018
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EB1620 Series
MECHANICAL DIMENSIONS
SUGGESTED SOLDER PAD LAYOUT
PIN
CONNECTION
1
Crystal
2
Cover/Ground
3
Crystal
4
Cover/Ground
All Tolerances are ±0.1
All Dimensions in Millimeters
Revised A: 05/18/2018
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EB1620 Series
TAPE & REEL DIMENSIONS
Quantity per Reel: 3,000 Units
All Dimensions in Millimeters
Compliant to EIA-481
Revised A: 05/18/2018
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EB1620 Series
RECOMMENDED SOLDER REFLOW METHOD
HIGH TEMPERATURE INFRARED/CONVECTION
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum(TS MAX)
- Time (tS)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
Target Peak Temperature(TP Target)
250°C +0/-5°C
Time within 5°C of actual peak (tp)
20 - 40 Seconds
Ramp-down Rate
6°C/Second Maximum
Time 25°C to Peak Temperature (t)
8 Minutes Maximum
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
Revised A: 05/18/2018
Page 6 of 10
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EB1620 Series
RECOMMENDED SOLDER REFLOW METHOD
LOW TEMPERATURE INFRARED/CONVECTION
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (Ts MIN)
- Temperature Typical (Ts TYP)
- Temperature Maximum(Ts MAX)
- Time (ts)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
5°C/Second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/Second Maximum
150°C
200 Seconds Maximum
245°C Maximum
Target Peak Temperature (TP Target)
245°C Maximum 2 Times / 230˚C Maximum 1 Time
Time within 5°C of actual peak (tp)
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Ramp-down Rate
5°C/Second Maximum
Time 25°C to Peak Temperature (t)
N/A
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
Revised A: 05/18/2018
Page 7 of 10
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